Experienced technician or engineer with basic knowledge of electronics.

Experienced senior technician, engineer or project manager, technical or design office manager, quality or reliability manager.

Know the technologies involved (diode, MOSFET, IGBT in Si, SiC and GaN) and learn a method for “reliability through technology” of a power module, from life profile to risk mitigation plan (performance, robustness, lifetime, process variability), via risk analysis (failure mechanisms).

Project Manager Engineer.

Projected and printed PowerPoint presentation, practical case study, exercises, role-playing, theoretical examples, video support….

Evaluation at start and end of training, quizzes…

5 working days before start of training (if OPCO funding)

INTRODUCTION

• General information on power electronics (history, definitions)
• Scope of power modules covered in the course (6500V – 500A)

PRESENTATION OF POWER MODULE TECHNOLOGIES

• Chips
• Diodes
• MOSFET
• IGBT
• New SiC and GaN technologies
• Connectors
• Chip top connectors (wires, ribbons, etc.)
• Connections on the underside of chips and substrates (soldering, sintering, etc.)
• Power connections (brazed, screwed pins, etc.)
• Substrates / Bases
• Nature and characteristics of substrates (SMI, AL2O3, AlN, Si3N4, DBC, AMB, etc.)
• Nature and characteristics of bases (Cu, AlSiC, etc.)

OUR “RELIABILITY THROUGH TECHNOLOGY” APPROACH

• Product life profile
• Risk analysis
  • Failure mechanisms (lifting of wires, delamination in solder joints, etc.)
• Risk elimination plan
  • Performance (standard / specification)
    • Automotive (AECQ, AQG-324…), aeronautics (DO), space (ESCC…), rail (IEC…), …
• Robustness
  • Defining robustness
  • Building a test plan, sequencing tests
  • HALT example
• Service life
  • Review of tests and their acceleration laws (Arrhenius, Coffin Manson, etc.)
  • Building a test plan, sequencing tests
• Process variability
  • Process control
  • Supplier audit

• Du 02/10/2024 au 03/10/2024 (Pessac)