Basic knowledge of board assembly.

AQF quality engineers, product managers, auditors, project managers, engineers, assembly process technicians… This training course is specific to assemblers, and focuses on materials and process control.

• Acquire the information required for the controlled implementation of assembly processes for electronic components.
• Assess the quality of assemblies by studying the various elements involved in the manufacture of the final product: printed circuits, hybrid circuits, components, leaded and lead-free soldering materials, bonding materials and others.
• Application skills: assembly (PTH, SMT), fluxing, soldering, profiling, packaging, storage, cleaning, etc.
• Control and failure analysis aspects, as well as essential rules to ensure process control.

Process project manager.

Projection and printed copies of Powerpoint presentations, practical case studies, exercises, situational examples, theoretical examples, video materials, etc.

Evaluation at the beginning and end of the course, quiz…

A training certificate complying with the provisions of Article L. 6353-1 paragraph 2 is issued to the trainee.

5 working days before the start of the course (if OPCO funding).

INTRODUCTION

• Industrial environment
• Reliability risks

SOLDERING

• Terminology and definitions: brazing, soldering, soldered joints, etc.
• Phase diagram (lead-tin)
• The lead/tin alloys used
• Lead-free solder
• Melting and remelting
• Phases: morphologies and evolution
• Intermetallic
• Wettability
• Solder creams
• Impact of lead-free on components and alloys
• Backward process

PRINTED CIRCUIT BOARDS AND MAIN ELECTRONIC COMPONENTS

Printed circuit boards :

• Technologies: double-sided,
  multilayer
• Physical characteristics: coefficient of thermal expansion, buckling, Tg
• Metallurgical finishes of soldering surfaces
• Sensitivity to humidity

Electronic components :

• Capacitors
• Relays
• Quartz

Plastic-cased components:

• Pin termination materials, balls (LED, BGA, μBGA and flip chip)
• Humidity sensitivity
• Non-destructive testing: visual, optical, acoustic and X-ray

Included in the 3rd day if this training is given in PESSAC: visit of a board assembly workshop (SMD, through-hole (PTH), manual soldering).

MANAGING THE RISK OF ELECTROSTATIC DISCHARGE

• Definition
• Sensitive components
• EPA zone

ELECTRONIC BOARD ASSEMBLY LINE

• Process Flow
• Influence of board design on process choice
• Storage of electronic components and printed circuit boards
• Deposition methods: silkscreen, syringe
• Placement machines (transfer)
• Temperature profile and control (reflow)
• Manufacturing controls
• Through-hole components
• Press Fit
• Wave soldering
• Other brazing methods
• Troubleshooting
• Cleaning
• Test
• Varnish
• System integration
• Packaging

PROCESS CONTROL

• Machine and process qualification
• Control of influencing parameters
• Manpower and work instructions
• Capability
• Gage R&R
• Failure mechanisms

MAIN STANDARDS AND ACRONYMS

AUDIT DIGEST

Included in Day 3 if this training is given in Pessac: Visit to a board assembly workshop (SMT, through-hole (PTH), manual soldering).

• Du 12/03/2024 au 14/03/2024 (Toulouse)
• Du 17/09/2024 au 19/09/2024 (Pessac)