Circuit board Assembly

Objectives

  • Acquire the information required for the controlled implementation of assembly processes for electronic components.
  • Assess the quality of assemblies by studying the various elements involved in the manufacture of the final product: printed circuits, hybrid circuits, components, leaded and lead-free soldering materials, bonding materials and others.
  • Application skills: assembly (PTH, SMT), fluxing, soldering, profiling, packaging, storage, cleaning, etc.
  • Control and failure analysis aspects, as well as essential rules to ensure process control.

  • INTRODUCTION
    • Industrial environment
    • Reliability risks
  • SOLDERING
    • Terminology and definitions: brazing, soldering, soldered joints, etc.
    • Phase diagram (lead-tin)
    • The lead/tin alloys used
    • Lead-free solder
    • Melting and remelting
    • Phases: morphologies and evolution
    • Intermetallic
    • Wettability
    • Solder creams
    • Impact of lead-free on components and alloys
    • Backward process
  • PRINTED CIRCUIT BOARDS AND MAIN ELECTRONIC COMPONENTS
    • Printed circuit boards :
      • Technologies: double-sided,multilayer
      • Physical characteristics: coefficient of thermal expansion, buckling, Tg
      • Metallurgical finishes of soldering surfaces
      • Sensitivity to humidity
    • Electronic components :
      • Capacitors
      • Relays
      • Quartz
    • Plastic-cased components:
      • Pin termination materials, balls (LED, BGA, μBGA and flip chip)
      • Humidity sensitivity
      • Non-destructive testing: visual, optical, acoustic and X-ray
  • MANAGING THE RISK OF ELECTROSTATIC DISCHARGE
    • Definition
    • Sensitive components
    • EPA zone
  • ELECTRONIC BOARD ASSEMBLY LINE
    • Process Flow
    • Influence of board design on process choice
    • Storage of electronic components and printed circuit boards
    • Deposition methods: silkscreen, syringe
    • Placement machines (transfer)
    • Temperature profile and control (reflow)
    • Manufacturing controls
    • Through-hole components
    • Press Fit
    • Wave soldering
    • Other brazing methods
    • Troubleshooting
    • Cleaning
    • Test
    • Varnish
    • System integration
    • Packaging
  • PROCESS CONTROL
    • Machine and process qualification
    • Control of influencing parameters
    • Manpower and work instructions
    • Capability
    • Gage R&R
    • Failure mechanisms
  • MAIN STANDARDS AND ACRONYMS
  • AUDIT DIGEST

 

Included in Day 3 if this training is given in Pessac: Visit to a board assembly workshop (SMT, through-hole (PTH), manual soldering).

Basic knowledge of board assembly.

AQF quality engineers, product managers, auditors, project managers, engineers, assembly process technicians… This training course is specific to assemblers, and focuses on materials and process control.

Process project manager.

Projection and printed copies of Powerpoint presentations, practical case studies, exercises, situational examples, theoretical examples, video materials, etc.

Evaluation at the beginning and end of the course, quiz…

5 working days before the start of the course (if OPCO funding).

A training certificate complying with the provisions of Article L. 6353-1 paragraph 2 is issued to the trainee.

2024 :

Satisfaction rate: 98%

Number of sessions: 7

Number of trainees: 31

AMONG OUR TRAINING

Qualification of automotive electronic systems

Introduction to circuit board assembly

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