Prérequis

Basic knowledge of active component technology.

Public concerné

Quality managers, project managers, laboratory and design staff.

Objectif

Understand the principles of chip fabrication and encapsulation, and grasp failure analysis through concerted case study examples.

Formateur

Engineer or project manager.

Teaching methods

Projected and printed PowerPoint presentation, practical case study, exercises, role-playing, theoretical example, video material…

Assessment methods

Evaluation at the beginning and end of the course, quiz…

A training certificate complying with the provisions of Article L. 6353-1 paragraph 2 is issued to the trainee.

Registration deadline

5 working days before the start of the course (if OPCO funding)

Programme

CHIP MANUFACTURING PRINCIPLES

  • Introduction
  • Materials
  • The technologies (semiconductors, conductors and insulators)
    • CMOS process
    • Bipolar process
    • BICMOS process
  • Examples of manufacturing defects

 

PACKAGING

  • General information on packaging
  • Assembly technologies
    • Wafer dicing
    • Die attach
    • Wiring process
  • Encapsulation

FAILURE ANALYSIS

  • Failure analysis goal and steps on active circuits
  • Techniques and methods
  • Examples of manufacturing defects on active components (diodes, transistors, ICs and optoelectronic components …)

Sessions

  • Du 13/03/2024 au 13/03/2024 (Pessac)
  • Du 16/10/2024 au 16/10/2024 (Pessac)
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Tarif

  • Price inter-company : 750€
  • Price intra-company : On request
  • Price Online : On request

2023 :

Satisfaction rate: 90%
Number of sessions: 4
Number of trainees: 13

 

REGISTRATIONS and INFORMATIONS :

  • Email : formation@serma.com
  • Tel. : +33 (0)5 57 26 29 92
  • Fax : +33 (0)5 57 26 08 98
  • Via the Contact form

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