Prerequisites

Fundamental knowledge of active component technology

Target audience

Quality managers, project managers, laboratory and design office staff

19 interns in 2021

Goal

Understand manufacturing technology and connected defects

Trainer

Engineer or project manager

Teaching methods

Projection and printed copies of Powerpoint presentations, practical case studies, exercises, situational examples, theoretical examples, video materials, etc.

Assessment methods

Assessments at the beginning and end of the course, quizzes, etc.

Registration deadline

5 working days before the course start date (if financed by OPCO)

Programme

PART 1 / CHIPS

  • Introduction
  • Materials
  • Technology
  • CMOS process
  • Bipolar process
  • BICMOS process
  • Chip reliability

 

PART 2 / PACKAGING

  • General aspects of packaging
  • Assembly technology
  • Wafer cutting
  • Chip attachment
  • Wired cabling
  • Encapsulation

 

Part 3 / FAILURE ANALYSIS

  • Failure analysis goal and steps
  • Techniques and methods
  • Manufacturing defects

Sessions

  • Du 08/03/2023 au 08/03/2023 (Pessac)
  • Du 04/10/2023 au 04/10/2023 (Pessac)
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Rates

  • Rate inter: €680 excl. tax / participant
  • Rate intra: on quotation
  • Online: on request

REGISTRATIONS and INFORMATIONS :

  • Email : formation@serma.com
  • Tel. : +33 (0)5 57 26 29 92
  • Fax : +33 (0)5 57 26 08 98
  • Via the Contact form

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