Active Component Technology

Objectives

Understand the principles of chip fabrication and encapsulation, and grasp failure analysis through concerted case study examples.

  • CHIP MANUFACTURING PRINCIPLES
    • Introduction
    • Materials
    • The technologies (semiconductors, conductors and insulators)
      • CMOS process
      • Bipolar process
      • BICMOS process
    • Examples of manufacturing defects
  • PACKAGING
    • General information on packaging
    • Assembly technologies
      • Wafer dicing
      • Die attach
      • Wiring process
    • Encapsulation
  • FAILURE ANALYSIS
    • Failure analysis goal and steps on active circuits
    • Techniques and methods
    • Examples of manufacturing defects on active components (diodes, transistors, ICs and optoelectronic components …)

Basic knowledge of active component technology.

Quality managers, project managers, laboratory and design staff.

Engineer or project manager.

Projected and printed PowerPoint presentation, practical case study, exercises, role-playing, theoretical example, video material…

Evaluation at the beginning and end of the course, quiz…

5 working days before the start of the course (if OPCO funding).

A training certificate complying with the provisions of Article L. 6353-1 paragraph 2 is issued to the trainee.

2024 :

Satisfaction rate: 95%

Number of sessions: 5

Number of trainees: 29

AMONG OUR TRAINING

Failure analysis (RCA) of electronic circuit boards

Failure Mechanisms

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