Knowledge of electronics and components desirable

Quality or technical manager, field/SAV analysis engineer or faced with a need to improve the reliability of an electronic board

Learn a practical method of troubleshooting on electronic boards

Reliability engineer for electronic components/cards

Projected and printed PowerPoint presentation, practical case study, exercises, role-playing, theoretical example, video material…

Evaluation at the beginning and end of the course, quiz…

5 working days before the start of the course (if OPCO funding)

DAY 1
DEFINITIONS

• Defect, failure mode, degradation, failure mechanism, failure cause, root cause

INTRODUCTION TO THE STAGES OF INVESTIGATION OF CAUSE

• The state of play: the description of the defect and its context of appearance
• Confirmation/characterisation of the fault
• Fault location at board and component level
• Observation/expertise of the defect
• Search and weighting of the failure mechanism
• Research and weighting of causes of failure

THE DESCRIPTION OF THE FAULT AND ITS CONTEXT OF OCCURRENCE

• Description of the product and the defect
• The product: its design, manufacturing process, history, etc.
• The defect: the facts (data), the conditions of occurrence, the REX, …
• Methods: QQOQC, 5W, IS-IS NOT, Graph, …
• Examples

METHODS OF LOCATING/CHARACTERISING THE FAULT ON THE MAP

• Failure modes and their particular cases (intermittence, instability, combustion, etc.)
• Localisation tools (objectives, limits and risks of altering the defect)
• Introduction to families of degradation mechanisms
• Methods of characterising a defect
• Consistency analysis of the results

FAILURE MECHANISMS AND WEIGHTING

• Reminder of definition: what is/is not a failure mechanism
• Introduction to interface failure mechanisms (PCBs, solder joints, connectors, plastic housings, etc.). Example.
• Introduction to failure mechanisms of passive components (thin film/thick film resistors, ceramic/tantalum/film/chemical capacitors, …)

DAY 2

FAILURE MECHANISMS AND WEIGHTING – CONTINUED

• Introduction to failure mechanisms of semiconductor components (diode, transistor, integrated circuit, …)
• Formalisation of hypotheses: list, diagram, etc.
• Weighting tools and criteria (objectives, methods, means, limits) :
  • Statistical analysis
  • Laboratory expertise
  • Defect reproduction
  • The expert opinion, …
• Example

CAUSES OF FAILURE ON ELECTRONIC CARDS AND WEIGHTING

• Reminder of definition: what is/is not a case
• Review of the families of causes of failure on electronic boards
• Hypothesis review methods: Brainstorming, Fault tree, Cause-effect diagram, Mind mapping, …
• Weighting tools and criteria (objectives, methods, means, limits) :
  • The experimental design
  • Laboratory expertise
  • The robustness test
  • Manufacturing process audit
  • Field measurements
  • The expert opinion, …
• Example

CAUSE AND ROOT CAUSE OF FAILURE ON ELECTRONIC CARD

• Date sur demande, toute l'année