Prerequisites

Knowledge of electronics and components desirable

Target audience

Quality or technical manager, field/SAV analysis engineer or faced with a need to improve the reliability of an electronic board

Goal

Learn a practical method of troubleshooting on electronic boards

Trainer

Reliability engineer for electronic components/cards

Teaching methods

Projected and printed PowerPoint presentation, practical case study, exercises, role-playing, theoretical example, video material…

Assessment methods

Evaluation at the beginning and end of the course, quiz…

Registration deadline

5 working days before the start of the course (if OPCO funding)

Programme

DAY 1
DEFINITIONS

  • Defect, failure mode, degradation, failure mechanism, failure cause, root cause

INTRODUCTION TO THE STAGES OF INVESTIGATION OF CAUSE

  • The state of play: the description of the defect and its context of appearance
  • Confirmation/characterisation of the fault
  • Fault location at board and component level
  • Observation/expertise of the defect
  • Search and weighting of the failure mechanism
  • Research and weighting of causes of failure

THE DESCRIPTION OF THE FAULT AND ITS CONTEXT OF OCCURRENCE

  • Description of the product and the defect
  • The product: its design, manufacturing process, history, etc.
  • The defect: the facts (data), the conditions of occurrence, the REX, …
  • Methods: QQOQC, 5W, IS-IS NOT, Graph, …
  • Examples

METHODS OF LOCATING/CHARACTERISING THE FAULT ON THE MAP

  • Failure modes and their particular cases (intermittence, instability, combustion, etc.)
  • Localisation tools (objectives, limits and risks of altering the defect)
  • Introduction to families of degradation mechanisms
  • Methods of characterising a defect
  • Consistency analysis of the results

FAILURE MECHANISMS AND WEIGHTING

  • Reminder of definition: what is/is not a failure mechanism
  • Introduction to interface failure mechanisms (PCBs, solder joints, connectors, plastic housings, etc.). Example.
  • Introduction to failure mechanisms of passive components (thin film/thick film resistors, ceramic/tantalum/film/chemical capacitors, …)

DAY 2

FAILURE MECHANISMS AND WEIGHTING – CONTINUED

  • Introduction to failure mechanisms of semiconductor components (diode, transistor, integrated circuit, …)
  • Formalisation of hypotheses: list, diagram, etc.
  • Weighting tools and criteria (objectives, methods, means, limits) :
    • Statistical analysis
    • Laboratory expertise
    • Defect reproduction
    • The expert opinion, …
  • Example

CAUSES OF FAILURE ON ELECTRONIC CARDS AND WEIGHTING

  • Reminder of definition: what is/is not a case
  • Review of the families of causes of failure on electronic boards
  • Hypothesis review methods: Brainstorming, Fault tree, Cause-effect diagram, Mind mapping, …
  • Weighting tools and criteria (objectives, methods, means, limits) :
    • The experimental design
    • Laboratory expertise
    • The robustness test
    • Manufacturing process audit
    • Field measurements
    • The expert opinion, …
  • Example

CAUSE AND ROOT CAUSE OF FAILURE ON ELECTRONIC CARD

Sessions

  • Date sur demande, toute l'année
Sign me up
Do you want more information? Contact us!

Rates

  • Rate: on request

REGISTRATIONS and INFORMATIONS :

  • Email : formation@serma.com
  • Tel. : +33 (0)5 57 26 29 92
  • Fax : +33 (0)5 57 26 08 98
  • Via the Contact form

Share the training course