Prerequisites
Knowledge of electronics and components desirable
Target audience
Quality or technical manager, field/SAV analysis engineer or faced with a need to improve the reliability of an electronic board
Goal
Learn a practical method of troubleshooting on electronic boards
Trainer
Reliability engineer for electronic components/cards
Teaching methods
Projected and printed PowerPoint presentation, practical case study, exercises, role-playing, theoretical example, video material…
Assessment methods
Evaluation at the beginning and end of the course, quiz…
Registration deadline
5 working days before the start of the course (if OPCO funding)
Programme
DAY 1
DEFINITIONS
- Defect, failure mode, degradation, failure mechanism, failure cause, root cause
INTRODUCTION TO THE STAGES OF INVESTIGATION OF CAUSE
- The state of play: the description of the defect and its context of appearance
- Confirmation/characterisation of the fault
- Fault location at board and component level
- Observation/expertise of the defect
- Search and weighting of the failure mechanism
- Research and weighting of causes of failure
THE DESCRIPTION OF THE FAULT AND ITS CONTEXT OF OCCURRENCE
- Description of the product and the defect
- The product: its design, manufacturing process, history, etc.
- The defect: the facts (data), the conditions of occurrence, the REX, …
- Methods: QQOQC, 5W, IS-IS NOT, Graph, …
- Examples
METHODS OF LOCATING/CHARACTERISING THE FAULT ON THE MAP
- Failure modes and their particular cases (intermittence, instability, combustion, etc.)
- Localisation tools (objectives, limits and risks of altering the defect)
- Introduction to families of degradation mechanisms
- Methods of characterising a defect
- Consistency analysis of the results
FAILURE MECHANISMS AND WEIGHTING
- Reminder of definition: what is/is not a failure mechanism
- Introduction to interface failure mechanisms (PCBs, solder joints, connectors, plastic housings, etc.). Example.
- Introduction to failure mechanisms of passive components (thin film/thick film resistors, ceramic/tantalum/film/chemical capacitors, …)
DAY 2
FAILURE MECHANISMS AND WEIGHTING – CONTINUED
- Introduction to failure mechanisms of semiconductor components (diode, transistor, integrated circuit, …)
- Formalisation of hypotheses: list, diagram, etc.
- Weighting tools and criteria (objectives, methods, means, limits) :
- Statistical analysis
- Laboratory expertise
- Defect reproduction
- The expert opinion, …
- Example
CAUSES OF FAILURE ON ELECTRONIC CARDS AND WEIGHTING
- Reminder of definition: what is/is not a case
- Review of the families of causes of failure on electronic boards
- Hypothesis review methods: Brainstorming, Fault tree, Cause-effect diagram, Mind mapping, …
- Weighting tools and criteria (objectives, methods, means, limits) :
- The experimental design
- Laboratory expertise
- The robustness test
- Manufacturing process audit
- Field measurements
- The expert opinion, …
- Example
CAUSE AND ROOT CAUSE OF FAILURE ON ELECTRONIC CARD
Sessions
- Date sur demande, toute l'année
Rates
- Rate: on request
REGISTRATIONS and INFORMATIONS :
- Email : formation@serma.com
- Tel. : +33 (0)5 57 26 29 92
- Fax : +33 (0)5 57 26 08 98
- Via the Contact form