Microelectronics
ASICs
- Creation of mixed, analogue and digital integrated circuits
- Extreme environments (from -200°C to +300°C)
- Radiation hardening & qualified space technologies
- Cloning of obsolete components
- ASSP catalogue products (RF, RFID), clone of VIC 068, 6802, 80C51…
- Development and supply of IPs
- “Fabless” Mode
- 15 million parts/year (small and medium production runs)
Packaging
- All assembly technologies
- Ceramic and plastic packaging
- Standard, customised or obsolete components
- Wafer cutting/Inspection/Chip sorting
- Specialisation in high-stress systems: medical implants, oil exploration, space applications

Thick and thin film ceramic substrate
- Multi-layer thick and thin film hybrid
- Drilling and machining of ceramic substrates
- Fields: defence, medical, industry