Microelectronics

ASICs

• Creation of mixed, analogue and digital integrated circuits
• Extreme environments (from -200°C to +300°C)
• Radiation hardening & qualified space technologies
• Cloning of obsolete components
• ASSP catalogue products (RF, RFID), clone of VIC 068, 6802, 80C51…
• Development and supply of IPs
• “Fabless” Mode
• 15 million parts/year (small and medium production runs)

Packaging

• All assembly technologies
• Ceramic and plastic packaging
• Standard, customised or obsolete components
• Wafer cutting/Inspection/Chip sorting
• Specialisation in high-stress systems: medical implants, oil exploration, space applications

Thick film ceramic substrate

• Multi-layer thick film hybrid
• Drilling and machining of ceramic substrates
• Fields: defence, medical, industry