Microelectronics
Microelectronics solutions for extreme environments
- Design office: design and industrialisation
- 1000m2 of production cleanroom space
- Test laboratory: electrical and environmental
Applications
ASIC | Hybrids | System-in-package | RF/Hyper/MMIC | Ceramic substrates | Power module
Our offer
Design
- ASIC, Hybrids
- Mixed-signal integrated circuits, analogue and digital
- Specific applications: high T°, radiation, etc.
- Cloning of obsolete components
- DFM / Process brick development
Production and assembly
- Wafer cutting, chip placement, bonding, etc.
- Hermetic/plastic packaging
- Special processes
- Strategic storage
- Outsourcing or sovereign supply chain
- 20 million parts per year (ASICs)
Testing
- Environmental screening
- Development of electrical tests
- Electrical characterisation and testing in production
- Failure analysis and expertise
- Reliability and Qualification of batches (test design and performance)