Failure Mechanisms

Course planning

• Definition and methodological introduction
• Introduction of the technology (materials involved) for each component family
• Presentation of the main weaknesses and ways of revealing them for each component family
• Application exercise
• Quizzes/Assessment of acquired knowledge

Day 1 : Component family concerned

• Printed circuit boards (PCB)
• Solder: Sn/Pb, SAC
• Resistors: thick film, thin film
• Capacitors: Ceramic, Tantalum,
• Electrolytic, Film
• Quartz: PTH and SMD
• Coils

Day 2 : Component family concerned

• Discrete semiconductors: diodes,
• LEDs and MOS transistors
• Active semiconductors: Si integrated circuits
• Discrete and integrated circuit packages
• Optocouplers

Basic knowledge of general electronics.

Quality or technical manager, field feedback engineer/SAV.

Electronic component/board reliability engineer.

Projection and printed copies of Powerpoint presentations, practical case studies, exercises, situational examples, theoretical examples, video materials, etc.

Evaluation at the beginning and end of the course, quiz…

5 working days before the start of the course (if OPCO funding).

A training certificate complying with the provisions of Article L. 6353-1 paragraph 2 is issued to the trainee.

2023 :

Satisfaction rate: 96%

Number of sessions: 3

Number of trainees: 14